Stamped Terminals

Product Description

Lead Frames 
As odd form packaging technologies continue to evolve, lead frames and lead frame components stand out as viable candidates for fully automated material handling systems. Conducive to reel-to-reel or insert molding processes, lead frames offer a wide variety of assembly options from microelectronics to automotive applications. 

As an ISO/TS 16949: 2009 certified manufacturer of precision stampings and lead frames, Autosplice stamping technologies offer a wide range of standard and custom solutions with material thickness from 0.001 inch (0.0254 mm) to 0.050 inch (1.27 mm), stepped-in laid and custom materials.